Follow this guide to repair iPhone 6 water damage problems. This guide offers you a very detailed logic board repairs solution to deal with the problems that iPhone 6 water damage issues. Let’s find out the faults together now.
Example of iPhone 6 Water Damage Problems 1 :
The iPhone 6 gets leakage after dropping into water and can be used for a short time with the battery.
iPhone 6 Water Damage Failure Phenomenon 1 :
The phone can be used for a short time with the battery after dropping into the water. There is no electricity the next day after the battery is fully charged and on standby.
iPhone 6 Water Damage Maintenance Procedures 1 :
Disassembled the phone and visually observed that the motherboard had obvious traces of water, and the inlet label on the main board had turned into red, as shown in Pic 5-61.
Pic 5-61 shows the color-change of water inlet phone
It was found that the motherboard components showed signs of corrosion and mildew after removing the main board shield. Cleaned the eroded area with water for cleaning panel and took out the severely discolored capacitors (see Pic 5-62). Dried the motherboard with the preheating table.
Pic 5-62 shows the material objects after removing the discolored corrosive capacitors
After the motherboard was dried, connecting it with an adjustable power supply, with the current of 16mA displayed. The normal iphone6 motherboard before turning on power should show 0.000A by the 4-digit-display ammeter. The display of 0.016A indicates the existence of leakage. According to the operating principle of iPhone, without pressing the switch, the whole board only has two voltages, PP_BATT_VCC and PP_VCC_MAIN. Therefore, it can be determined that the failure of the leakage was on these two voltages, but because of the many components connecting the two voltages, they had to be judged separately. The PP_BATT_VCC battery was tested first. The location of the connected circuit of the PP_BATT_VCC supply in the bitmap is shown by yellow in Pic 5-63.
Pic 5-63 The location of the connected circuit of the PP_BATT_VCC supply in the bitmap is shown by yellow
Removed the Q1403 and U1401 and disconnected the PP_VCC_MAIN. No current was detected after power-on, therefore, the failure can be located on the PP_VCC_MAIN. Usually, motherboards with more severe electrical leakage can be judged by fumigating rosin on the components. However, leakage of this board was not serious and there were no obvious heating components. So smoked rosin cannot work here and components could only be removed one by one. There were many components on the voltage of PP VCC MAIN through the bitmap. The location of the connected circuit of the PP_VCC_MAIN circuit in the bitmap is shown by yellow in Pic 5-64.
Pic 5-64 The location of the connected circuit of the PP_VCC_MAIN circuit in the bitmap is shown by yellow
When dismantling, first removed the capacitors on the connected circuit, and then removed the chips connecting the capacitors. When the Upscale chip U3052_RF of near-field communication (UFC) was being removed, connected to the adjustable power supply and found no leakage. Pic 5-65 shows the material objects after removing fingerprint boost chip, flash chip, and display chip.
Pic 5-65 The mother board after removing fingerprint boost chip, flash chip, and display chip.
It was the NFC Upscale chip U5302_RF (see Pic 5-66) that caused leakage, its bonding pad location on the motherboard is as shown in Pic 5-67.
Pic 5-66 The NFC Upscale chip U5302_RF
Pic 5-67 The bonding pad location of NFC Upscale chip U5302_RF in the motherboard
Reinstalled the other removed components back to the motherboard and handled the installation. There was no problem with the test for two days. The phone was repaired.
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